Layer Count
1-12 Layers
Base Material
CEM3, Aluminum Clad, Polymide, Rogers, FR4, FR5
Finish Board Thickness
0.20 mm ~ 3.20 mm
Minimum Core Thickness
0.1mm(4 mil)
Copper Thickness
Min. 1/2 OZ, Max. 6 OZ
PTH Wall Thickness
20um(0.8mil) min.
Min. Track
S/Sided
0.100 mm ( 4 mil )
Min. Space
D/Sided
0.100 mm ( 4 mil )
Min. Hole Dia.
Drilling /PTH
φ0.2 mm ( 10 mil )
Punching
φ1.0 mm ( 40 mil )
Dimension Tolerance
Hole Position
±0.076 ( 3 mil )
Conductor Width(W)
±20% Deviation of Master A/W
Outline Dimensions
±0.13 mm ( 5 mil )
Surface Finish

Immersion Gold, Flash Gold, HASL, Nickel Plate, LF HASL

Soldermask pitch
0.1mm(5mils) min.
V-CUT
Board Thickness
0.50 mm (20mil) min.
Remain Thickness
1/3 board thickness
Tolerance
±0.13 mm(5mil)
Min. space - hole edge to trace
PTH hole: 0.20mm(8mil)
NPTH hole: 0.18mm(7mil)
Thermal Shock
3x10Sec@288 ℃
Warp and Twist
≤0.75%
Electric Strength
>1.3KV/mm
Peel Strength
>1.4N/mm